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广积科技MB875嵌入式工业主板

———广积科技MB875嵌入式工业主板

CPU 插座
Socket 479 or CPU on board
CPU
Supports Intel(R) Pentium(R) M, Celeron(R) M Up to 2.0GHz
CPU Front Side Bus ( FSB 前端总线)
400MHz
芯片组
Intel(R) 852GM chipset + ICH4
BIOS
Award BIOS
系统内存
Two DDR266/333 sockets support up to 2GB
视频
Intel(R) 852GM integrated graphics DVMT 2.0 shared memory, Max. 96MB
网络
Four Intel(R) 82541PI Gigabit LAN Four RJ-45 ports on board
基本输出/输入
Winbond W83627HF, Finktek 81216 Supports 2x IDE (UDMA33/66/100), 2x SATA, 4x RS-232, 1x KB, 1x Mouse
IDE 界面
Two enhanced IDE channel supports: IDE channel 1 - 40 pin for master; 44 pin for slave IDE channel 2 - CF socket for master 2 IDE devices; supports UDMA33/66/100

SSD Interface
CompactFlash socket, Type II, via IDE2

特点

支持 Intel(R) Pentium(R) M / Intel(R) Celeron(R) M processors, up to 2.0GHz @ 400MHz FSB
Intel 852GM Chipset, Two DDR socket, Max. 2GB
Four Intel(R) 82541PI GbE controllers for four GbE support
Edge connector supporting PCI 33MHz/32-bit interfaces
4 x COM, 4 x USB 2.0, 2 x SATA, CF socket
Watchdogi timer, 1 x PCI, 1 x Mini PCI
180mm x 270mm

USB (2.0)
Supports 2 USB ports on board
and 2 USB ports via pin header
Serial ATA
Supports 2 ports
Edge Connectors
4x RJ45, COM1, 2x USB 2.0
键盘鼠标
PS/2 type
看门狗
Generates system reset; 256 levels
数字I/O
4 in / 4 out
扩充槽
1 x Mini PCI socket
1 x PCI Edge connector supporting PCI 33MHz/32-bit interfaces
电源
ATX power connector
其他
GPInput switch, LEDs on edge include Power LED
HDD Access LED and GPO LED 1/2.
Form Factor
Custom Motherboard
尺寸
180mm x 270mm
环境条件:
运行温度:
0°C~60°C (32°F~140°F)
储存温度:
-20°C~80°C (-68°F~176°F)
相对湿度:
10%~90% (non-condensing)
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【文章来自米尔自动化网http://www.mirautomation.com/html/news/2007-08-13/np0000471012.shtml
本文标签: 工业主板  
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